View Issue Details
| ID | Project | Category | View Status | Date Submitted | Last Update |
|---|---|---|---|---|---|
| 0001886 | T99X171.00 SKB Eagle | HW Issue | public | 2024-01-31 14:44 | 2024-10-22 14:20 |
| Reporter | (ALTech) SH Son | Assigned To | (MFG) Rachel Ruan | Due Date | |
| Priority | normal | Severity | s4-minor | Reproducibility | have not tried |
| Status | closed | Resolution | fixed | ||
| Summary | 0001886: [Eagle] Field issue : request the FA about replaced RMA IC | ||||
| Description | [Eagle] Field issue : request the FAR about replaced RMA IC According to the request of the customer’s quality manager, we have to proceed the FAR for Top2 defected IC. the quality manager reviewed the results of previous repairs data. And they want to why replace the too many CPU/eMMC. Top1. U602 : IC eMMC 8GB 2.7~3.6V 5nS SMD FBGA153 GP/067.00140.005LT Top2. U1 : PER 1.8/3.3V SMD FCBGA393 GP/HF A /002.02753.005 After discussing with them, please proceed with FAR for each defect symptom. - Defect STB range : RMA Lot 13 (https://btracker-cns.fii-foxconn.com/vaas/view.php?id=1858) : Can't download Factory FW (3%) U1*10pcs, U602 *10pcs : Can't download Factory FW (Stop at 7%) U602*10pcs : HDMI function test fail U1*5pcs, U602 *5pcs : LED Status light abnormal U1*5pcs, U602 *5pcs : No Ping U1*5pcs, U602 *5pcs - Please marking the each fail symptom on the report. - If you have any problem with proceed the vendor FA report, please let me know, ALT will push them. Thanks SON | ||||
| Tags | No tags attached. | ||||
| Attach Tags | |||||
| related to | 0001858 | closed | (PM) Roisy Liang | [Eagle] 2023.12 Monthly RMA_KR (Lot 13) shipping list |
| related to | 0001884 | feedback | (ALTech) SH Son | [Eagle] Field issue analysis |
| User List |
(ALTech) BY Lee , (ALTech) JW Kim , (ALTech) Lonnie Kim , (ALTech) SH Son , (ALTech) Sophie Lee , |
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Hi Rachel and An. According to the request of the customer’s quality manager, I request failure analysis of Top2 defected IC. Please proceed defect analysis with IC vender on RMA Lot13. If you have any question, please contact me. Thanks SON |
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Dear SH Son Got it We will provide FA report for Top2. U1 : PER 1.8/3.3V SMD FCBGA393 GP/HF A /002.02753.005 soon. Many Thanks Rachel |
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HI Rachel, Please proceed FA report for Top1. U602 : IC eMMC 8GB 2.7~3.6V 5nS SMD FBGA153 GP/067.00140.005LT if you have any issue with vender, please let me know. ALT will will push for the proceed FA. THanks SON |
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0001858:0015712 RMA BFX AT-100 Top Failure Issue Report |
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Hi Rachel, An and Roisy Thank you for the TOP 1&2 failure symptom analysis. but, ALT and customer want to review the SoC failure analysis report. so, please update Amlogic FA due date. -as Factory report : eMMC SAMSUNG.Duedate:20/05 If you have any problem with SoC FA, please let me know. we will direct contact to SoC HQ. Thanks SON |
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Dear SH Son We contacted Amlogic vendor , because the previous times we analyzed NG samples, the results were all NTF. So the Amlogic wants the factory to confirm the exact defect before sending the material for analysis. On 14/May/2024, the supplier amlogic agreed to receive NG IC ( U1 * 5 pcs ) for analysis. and the supplier's FA period is 30/June/2024. Samsung supplier confirmed that the FA process is within 1 month of receiving the NG sample, so the due date will be updated to 31/May/2024.. Fii have updated the due date in the BFX AT-100 RMA TOP FAILURE REPORT FA report, and continue to push suppliers to analyze and return results on schedule. Many thanks PQE-Rachel |
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Hi Rachel. Please update eMMC (Samsung) vender FA report. Thanks SON |
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Dear SH Son So sorry On 29/05 SamSung vendor feedback for this issue: ( Pls review SAMSUNG FA report ) 1. Visual Inspection & DC Test result => Pass 2. FW Analysis Result => Pass 1/4 3. Check NAND Level Test Result: To duplicate the customer failure symptom, functional test was performed. The results PASS 4. Functionality & Aging Test: Vendor samsung performed the Aging test over 24 hours totally on the chamber. As a result, device had passed an additional test without any failure symptoms. Conclusion => Based on the test results, we think the failed units were caused by unexpected environment which is sudden power off, unstable power supply etc by by product users. Action: 1. Continue co-work with SAMSUNG vendor taking action and more detailed reason for this issue. Owner: PE_Luc. Due date: 05/06 2. Customers should update and maintain equipment: Ensure equipment is updated with software and perform routine maintenance to minimize errors due to software problems mechanical damage. 3. Identify and repair infrastructure issues: Inspect and repair infrastructure-related issues such as electrical wiring, outlets, electrical panels. Etc.cc to ensure that they meet safety and operational standards. Many thanks Rachel |
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Hi Rachel. Please update eMMC (Samsung) vender FA report. Thanks Joung |
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Dear Mr.Joung, Rachel updated eMMC (Samsung) vender FA report file as the above attached file" FOXCONNTECHNOLOGYCO.,LTD_TW240137_FA_report_CND". Related to action 1" Continue co-work with SAMSUNG vendor taking action and more detailed reason for this issue. Owner: PE_Luc. Due date: 05/06", SAMSUNG vendor still has not taken action yet for this issue. We are still pushing and ask vendor take action ASAP. If having any update, we will update to you right now. Many thanks Roisy |
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Dear SH Son and Mr.Joung, PE updated FA report and take action as below: "SQE as sent feedback to SamSung about the action but there are any actions for this issue. They believe that this problem belongs to customers when using a sudden power off, unstable power supply etc... The causes FW corruption and leads to errors such as Meta corruption and UECC (uncorrectable ECC error) in eMMC. Belows are some actions Fii recommends for customers: Customers use of power stabilizers, power filters, separate power supply installation, regular maintenance, lightning protection devices, electrical system design, electrical system design according to standards and FW/Software testing periodic hardness. =>These solutions will help increase power supply stability, minimize the risk of eMMC damage, and improve EMMC burning FW fail." Please kindly check the attached file and let me know if you have any questions. Many thanks Roisy |
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Hi Roisy. The below feedback has been received from Samsung, the received data forward us. -> is the causes FW corruption and leads to errors such as Meta corruption and UECC (uncorrectable ECC error) in Emmc . Please check if there are any emmc burning issues and power when testing at the factory. Thanks. joung. |
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Hi Roisy In addition to above Joung's question, I have some question about your report. 1. S/N: 2149688001202201349677(MAC: 38D57ADC517F) 1) This unit returned "Ethernet fail" from field. And failed eMMC download in your factory. So, I think you check your download JIG's power status. Please check first your download JIG's power status. 2) Regarding below comments, is that Samsung's official comments or your factory comments? If it is Samsung's official comments, please provide received e-mail from Samsung. "Based on the test customer’s results, we think the failed units were caused by unexpected environment which is sudden power off, unstable power supply etc… is the causes FW corruption and leads to errors such as Meta corruption and UECC (uncorrectable ECC error) in Emmc. Action: Customers use of power stabilizers, power filters, separate power supply installation, regular maintenance, lightning protection devices, electrical system design, electrical system design according to standards and FW/Software testing periodic hardness. These solution will help increase power supply stability, minimize the rick of eMMC damage, and improve EMMC burning FW fail." Best regards Lonnie Kim |
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Dear Mr. Joung and Mr. Lonnie Kim, Sorry for replying late. Please help to check Foxconn's feedback as below: 1. S/N: 2149688001202201349677(MAC: 38D57ADC517F) This unit returned "Ethernet fail" from field. And failed eMMC download in your factory. So, I think you check your download JIG's power status. Please check first your download JIG's power status. Foxconn replied: 1. The product was tested and passed all functions at all station before being delivered to the customers. 2. After the customer return an "Ethernet fail" from field. when chewing at the factory, the boot up status was unsuccessful, which indicated issues related to the: SoC, eMMC or other components. --> this issue according to eMMC. 3.1 For example, if a product had only led failure during production = > Replacing the Led => UK station <download Factory FW was successful> => Re-test passed the normal process. 3.2 In the cause of the "boot up failure" due to eMMC the download Factory FW failed (at 7%) at UK station=> Change new eMMC => UK successful => Passed normal process. --> This issue only occurs products returning with a "boot up fail related to eMMC" so it is not related to the power supply for products in the factory. 2) Regarding below comments, is that Samsung's official comments or your factory comments? If it is Samsung's official comments, please provide received e-mail from Samsung. Foxconn replied: Those are the judgments based on Samsung supplier's results analysis report. The factory has never encountered this error during FATP production. Many thanks, Roisy |
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Hi Roisy, Thank you for feedback and understand your answers. But, it might misunderstood the intent of our questions. I'll ask you questions another way. 1. Please let me know customer S/N and MAC address these STBs. (proceed eMMC vender FA SET S/N) 2. Please review again what could constitute an unexpected situation related STB Power in the factory environment. : From my experience, it's possible that the power supply may be unstable in the factory until the download of Factory FW process (S01 LED sorting, S02 LED change, and UK) : ALT has reviewed the unexpected situation related to STB power on the end-user side and determined that there is a low possibility due to DC power operation : And also this STB (MAC: 38D57ADC517F) was used normally including the OTA function before it was returned due to an Ethernet failure. 3. Please let me know vender (Samsung) contact point. : we have some of questions. I think it would be more efficient to inquire directly in Korean. Thanks SON |
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Dear SH Son Very sorry for the late update this issue to you. 1. Please check the list SN number with the SamSung components to be analyzed (proceed eMMC vender FA SET S/N) . Note: Because Samsung does not accept analysis of components that are more than 2 years old, we replaced them with 2 other DC of 2 defective products with the same error failure. (Please see details in the table below) 2. Fii RMA process : Sorting LED => Change new led => UK test =.> We did not find any abnormalities related to the power source environment . All (NG+OK) products are used in the same test environment so errors are unlikely and the factory's equipment: machine, power sources,..vv are guaranteed to be checked periodically every day. You suspect the error is due to a power cut during FW loading at the production line at factory , but that is not true. Because if the power is turned off during the download process, the product can still be downloaded again successfully ( OK normal products) . But with this product, it only downloads Factory FW stop at 7% and can't download again. When we analyze the STB (MAC: 38D57ADC517F), => Fail Show: the product boot up failed and can't download Factory FW stop 7%. PE engineer analyzed faulty component U602. ( As FA report) 3. 3. Please let me know vender (Samsung) contact point. : we have some of questions. I think it would be more efficient to inquire directly in Korean. ==.> PLs check this item with RD PM : Cato and Miya Many thanks Rachel |
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Hi, Rachel What is your opinion of "CND (Can Not Duplicated)" from Samsung report. That means there would be no issue about component level. Best regards Lonnie Kim |
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Dear Lonnie Kim This is my opinion about CND issue of eMMC failure. 1. CND (Can Not Duplicated) in the context of eMMC means that the issue that occurred cannot be reproduced This often signifies that technicians or engineer of SAMSUNG are unable to recreate the problem reported or encountered by the customer during testing. Possible causes are the following factors: unstable power supply,ramdom errors, different usage or use of equitment different from the test enviroment,... 2. Test items:3.2.3 FW Analysis Result from SAMSUNG report. -> Firmware analysis result for Meta Corruption and UECC erros were detected, which confirms a problem with the eMMC component. => When checking at the Foxconn factory and vendor SAMSUNG, both CND (Can Not Duplicated) of the customer's environments occurred causing eMMC error. Therefore, the exact cause cannot be concluded. Many thanks Rachel |
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Dear Lonnie Kim As said in the WeChat group, Fii hope ALT customer will help contact Samsung and clarify this issue. Because in RMA Lot 14, 15 and 16, we defect more 4 pcs with the same failure issue. We will prepare the failure IC, we are ready to send it to the vendor for further analysis of this problem. Pls help contact with Samsung follow information as bellow: Many thanks Rachel |
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Hi Rachel, Please update the due date for eMMC 4 pcs vendor analysis schedule. Thanks SON |
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Dear SH Son T99X171.00 RMA 14, 15, 16 lots are still in the process of analysis, repair and retesting. The number of U602 failures is increasing. We are compiling an FA report to send to vendor Samsung . Fii FA will be ready on 05/Jul , then SQE will contact and send FA report to vendor Samsung and wait for the vendor to confirm the address to send NG IC for analysis. We will update the sending materials status and push reports from Samsung. Many thanks Rachel |
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Dear SH Son On 06/Jul, Fii send email FA report eMMC material issue to Samsung and waiting Samsung feedback address for our shipper 5pcs eMMC for analysis. We hope for cooperation from Samsung to find the root cause of the problem and have action improvements. We also hope to receive support from ALT for this issue too. Many thanks Rachel |
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Hi Rachel Thank you for your support about eMMC FA with vender. Please update the U1 (Amlogic) FA report as well. The last FA report stated that "On May 14, 2024, the supplier Amlogic agreed to receive NG ICs (U1 * 5 pcs) for analysis. The supplier's FA period is until June 30, 2024." Thanks SON |
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Dear SH Son We are very sorry about the U1 failure issue and not updating customers. Because on 20/May/2024 , we received an email from supplier Amlogic saying that they do not accept DC 2023 material analysis. So in batch RMA 14, 15,16 we are contacting to send again. If possible, we would like to ask for help from ALT customer, because we also send other DCs to Amlogic before and that FAs we receive Amlogic all confirm that they can cover 100% by the test program. The factory side continues to monitor this issue. Many thanks |
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Dear SH Son I update the status for eMMC 5 pcs NG ( P/N:067.00140.005 / MPN:KLM8G1GETF-B041 ( Vendor:SAMSUNG) ) sent to vendor analysis . On 29/Jul/2024, NG samples have been sent. DHL tracking: 8935698203. Pls note ! Please help contact with the SAMSUNG Korean vendor to soon issue an analysis report on this issue. Many thanks Rachel |
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Hi Rachel Ruan reply 0001886:0016357 could you please update the due date for eMMC 5 pcs NG FA report? Thanks SON |
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Dear SH Son About eMMC 5 pcs sent to Samsung for more analysis. We are very sorry to late updated, but eMMC has not yet had an FA response from the SamSung supplier, we are still urging the supplier to quickly issue a report. Many thanks Rachel |
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HI Rachel As we discussed with FII and Amlogic TW via email, please update the Amlogic FA status and due date. Thanks SON |
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Dear SH Son I update the status for Amlogic 5 pcs NG sent to vendor analysis . We sent NG material to Amlogic vendor on 10/August, and that party received on 12/August. They will analyze and update FA for Fii as soon as possible. DHL tracking: 7564636332. Pls note Many thanks Rachel |
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Dear SH Son About eMMC 5 pcs sent to Samsung for more analysis. Samsung update analysis status, they have responded that FA can be released next week. We will update to ALT customers when we receive FA from SAMSUNG vendor. Many thanks Rachel |
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Dear SH Son I updated FA Samsung and Amlogic supplier report. QA manager has viewed. The report content is not much different from the previous one. 1. SAMSUNG still concluded the same the last report. " Based on the test results, we think the failed units were caused by unexpected environment which is sudden power off, unstable power supply etc. " 2. Amlogic also concluded " All chips failed FT with Open/Short and were observed USBOTG_B pins O/S through the IV-Curve test" Pls help review detail the report and if have any questions pls co-work with RD and MFG team. Many Thanks Rachel |
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Hi Rachel. Thank you for your support. 1. For Amlogic S905X2 : FA report is accepted. Close this case and we may will request FA again later 2. For Samsung eMMC : Meta corruption was already reviewed. a. Please ask to Samsung for TBW values of all eMMC. b. Please submit factory FA report for Mechanical Damage. Thanks SON |
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Hi Rachel Please update as my request. 2. For Samsung eMMC : Meta corruption was already reviewed. a. Please ask to Samsung for TBW values of all eMMC. b. Please submit factory FA report for Mechanical Damage. Thanks SON |
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Dear Sh Son ( Rachel Reply ): Sorry for updating to ALT so late. a. Please ask to Samsung for TBW values of all eMMC. => Pls help check Sam Sung detail report. ( Samsung KL8G1GETF-B041 TBW is 8TB. - Please refer attach file p20.) b. Please submit factory FA report for Mechanical Damage. => We on monitor this issue and will update FA to you on late 24/Sep/2024. Many thanks Rachel |
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Hi Tony (Rachel) Thank you for the update. also please ask Ted (Samsung FAE in Taiwan) about TBW value like my question (attached email) Thanks SON |
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Dear Sh Son ( Rachel Reply ) a. Please ask to Samsung for TBW values of all eMMC. => I will inform to Samsung vendor and feedback to you soon the result. b. Please submit factory FA report for Mechanical Damage. => PLs help review T99X171.00 Mechanical Damage FA Risk Assessment Report. Many thanks Rachel |
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HI Rachel, about FA report, 0001886:0016762. Could you please add the analysis during RMA process? Thansk SON |
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Hi Rachel. Please update a. TBW values of all eMMC. b. FA report for Mechanical Damage -> add the analysis during RMA process Thanks SON |
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Dear SH Son Sorry for late update: Pls help review this document: a. TBW values of all eMMC. ==> Pls review Samsung document: Remark: Note the E in the formula. E=10 to the seventh power ). b. FA report for Mechanical Damage -> add the analysis during RMA process Many thanks Rachel |
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HI Rachel Thank you for the update and support. Closed this issue. |
| Date Modified | Username | Field | Change |
|---|---|---|---|
| 2024-01-31 14:44 | (ALTech) SH Son | New Issue | |
| 2024-01-31 14:45 | (ALTech) SH Son | Relationship added | related to 0001884 |
| 2024-01-31 14:55 | (ALTech) SH Son | Summary | [Eagle] Field issue : request the FAR about replaced RMA IC => [Eagle] Field issue : request the FA about replaced RMA IC |
| 2024-02-06 17:15 | (SW) Jacky Chiang | Severity | s2-severe => s4-minor |
| 2024-02-15 15:26 | (ALTech) SH Son | Relationship added | related to 0001858 |
| 2024-02-16 13:26 | (ALTech) SH Son | Assigned To | => (MFG) Rachel Ruan |
| 2024-02-16 13:26 | (ALTech) SH Son | Status | new => assigned |
| 2024-02-16 13:26 | (ALTech) SH Son | Description Updated | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) BY Lee | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) JW Kim | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) Lonnie Kim | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) SH Son | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) Sophie Lee | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) Sun Choul Joung | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (ALTech) SY Yoon | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (MFG) An Tran | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (MFG) Ben Trinh | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (PM) Dennis Lu | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (PM) Roisy Liang | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (PM) Sheila Tu | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (PM) Tiffanie Lai | |
| 2024-02-16 13:26 | (ALTech) SH Son | Issue Monitored: (Sales) Miya Wang | |
| 2024-02-16 13:27 | (ALTech) SH Son | Issue Monitored: (HW) Sean Chiang | |
| 2024-02-16 13:27 | (ALTech) SH Son | Issue Monitored: (HW) Cooper Kung | |
| 2024-02-16 13:30 | (ALTech) SH Son | Note Added: 0015134 | |
| 2024-02-16 13:47 | (ALTech) SH Son | Description Updated | |
| 2024-02-16 17:57 | (MFG) Rachel Ruan | Note Added: 0015141 | |
| 2024-02-19 09:40 | (ALTech) SH Son | Note Added: 0015145 | |
| 2024-05-13 11:15 | (ALTech) SH Son | Note Added: 0015757 | |
| 2024-05-13 11:27 | (ALTech) SH Son | Note Added: 0015760 | |
| 2024-05-13 11:27 | (ALTech) SH Son | Note Edited: 0015760 | |
| 2024-05-14 15:12 | (MFG) Rachel Ruan | Note Added: 0015790 | |
| 2024-05-14 15:13 | (MFG) Rachel Ruan | Note Edited: 0015790 | |
| 2024-05-14 15:13 | (MFG) Rachel Ruan | Note Added: 0015791 | |
| 2024-05-14 15:13 | (MFG) Rachel Ruan | File Added: T99X171.00(BFX AT-100) Top Failure issue Report 20240514.pptx.pptx | |
| 2024-06-03 09:26 | (ALTech) SH Son | Note Added: 0015935 | |
| 2024-06-03 20:22 | (MFG) Rachel Ruan | Note Added: 0015938 | |
| 2024-06-03 20:22 | (MFG) Rachel Ruan | File Added: T99X171.00(BFX AT-100) U602-eMMC Failure FA Report.pptx | |
| 2024-06-03 20:22 | (MFG) Rachel Ruan | File Added: FOXCONNTECHNOLOGYCO.,LTD_TW240137_FA_report_CND(5).pdf | |
| 2024-06-07 07:16 |
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Note Added: 0015965 | |
| 2024-06-07 07:16 |
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File Added: image.png | |
| 2024-06-07 18:28 | (PM) Roisy Liang | Note Added: 0015969 | |
| 2024-06-07 18:28 | (PM) Roisy Liang | File Added: image-2.png | |
| 2024-06-13 15:49 | (PM) Roisy Liang | Note Added: 0016014 | |
| 2024-06-13 15:49 | (PM) Roisy Liang | File Added: T99X171.00(BFX AT-100) eMMC Failure FA Report.pptx | |
| 2024-06-17 13:26 |
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Note Added: 0016052 | |
| 2024-06-17 14:27 | (ALTech) Lonnie Kim | Note Added: 0016053 | |
| 2024-06-19 12:17 | (PM) Roisy Liang | Note Added: 0016067 | |
| 2024-06-19 15:04 | (ALTech) SH Son | Note Added: 0016070 | |
| 2024-06-19 15:04 | (ALTech) SH Son | File Added: image-3.png | |
| 2024-06-22 18:51 | (MFG) Rachel Ruan | Note Added: 0016082 | |
| 2024-06-22 18:51 | (MFG) Rachel Ruan | File Added: image-4.png | |
| 2024-06-22 18:51 | (MFG) Rachel Ruan | File Added: List SN SAMSUNG analysis.xlsx | |
| 2024-06-24 11:08 | (ALTech) Lonnie Kim | Note Added: 0016092 | |
| 2024-06-27 14:59 | (MFG) Rachel Ruan | Note Added: 0016110 | |
| 2024-06-27 17:46 | (MFG) Rachel Ruan | Note Added: 0016114 | |
| 2024-06-27 17:46 | (MFG) Rachel Ruan | File Added: image-5.png | |
| 2024-06-27 17:46 | (MFG) Rachel Ruan | File Added: image-6.png | |
| 2024-06-27 17:46 | (MFG) Rachel Ruan | File Added: PN067.00140.005 MPNKLM8G1GETF-B041 ( Vendor SAMSUNG) RMA BFX AT-100 boot up fail..pdf | |
| 2024-07-03 12:49 | (ALTech) SH Son | Note Added: 0016161 | |
| 2024-07-04 10:08 | (MFG) Rachel Ruan | Note Added: 0016168 | |
| 2024-07-09 15:08 | (MFG) Rachel Ruan | Note Added: 0016225 | |
| 2024-07-11 11:03 | (ALTech) SH Son | Note Added: 0016242 | |
| 2024-07-11 20:22 | (MFG) Rachel Ruan | Note Added: 0016251 | |
| 2024-07-11 20:22 | (MFG) Rachel Ruan | File Added: Mail feedback ò AMLOGIC Vendor ( RMA BFX AT-100 NO BOOT ISSUE).pdf | |
| 2024-07-30 12:01 | (MFG) Rachel Ruan | Note Added: 0016357 | |
| 2024-07-30 12:01 | (MFG) Rachel Ruan | File Added: image-7.png | |
| 2024-07-30 12:01 | (MFG) Rachel Ruan | File Added: image-8.png | |
| 2024-07-30 12:01 | (MFG) Rachel Ruan | File Added: image-9.png | |
| 2024-08-05 13:17 | (ALTech) SH Son | Note Added: 0016387 | |
| 2024-08-05 18:04 | (MFG) Rachel Ruan | Note Added: 0016390 | |
| 2024-08-13 08:13 | (ALTech) SH Son | Note Added: 0016449 | |
| 2024-08-13 17:50 | (MFG) Rachel Ruan | Note Added: 0016458 | |
| 2024-08-22 15:33 | (MFG) Rachel Ruan | Note Added: 0016544 | |
| 2024-08-22 15:33 | (MFG) Rachel Ruan | File Added: image-10.png | |
| 2024-08-29 17:58 | (MFG) Rachel Ruan | Note Added: 0016610 | |
| 2024-08-29 17:58 | (MFG) Rachel Ruan | File Added: FAZ240806_S905X2-B_Foxconn_ USB failure report.pdf | |
| 2024-08-29 17:58 | (MFG) Rachel Ruan | File Added: FOXCONNTECHNOLOGYCO.,LTD_TW240259_FA_report_CND(4), MD(1).pdf | |
| 2024-09-02 13:34 | (ALTech) SH Son | Note Added: 0016623 | |
| 2024-09-23 10:25 | (ALTech) SH Son | Note Added: 0016747 | |
| 2024-09-23 17:09 | (MFG) Toney Tu | Note Added: 0016757 | |
| 2024-09-23 17:09 | (MFG) Toney Tu | File Added: PQM170124002] 8GB eMMC 153FBGA (FET-B 64Gb MLC NAND_Vincent)_KLM8G1GETF-B041.pdf | |
| 2024-09-23 17:26 | (MFG) Toney Tu | Note Edited: 0016757 | |
| 2024-09-23 17:27 | (MFG) Toney Tu | Note Edited: 0016757 | |
| 2024-09-24 16:41 | (ALTech) SH Son | Note Added: 0016761 | |
| 2024-09-24 16:41 | (ALTech) SH Son | File Added: image-11.png | |
| 2024-09-24 17:48 | (PM) Roisy Liang | Issue Monitored: (MFG) Rachel Ruan | |
| 2024-09-24 18:10 | (MFG) Toney Tu | Note Added: 0016762 | |
| 2024-09-24 18:10 | (MFG) Toney Tu | File Added: T99X171.00 Mechanical Damage FA Risk Assessment Report.pptx | |
| 2024-09-25 10:10 | (ALTech) SH Son | Note Added: 0016764 | |
| 2024-10-14 10:58 | (ALTech) SH Son | Note Added: 0016835 | |
| 2024-10-14 16:26 | (MFG) Rachel Ruan | Note Added: 0016839 | |
| 2024-10-14 16:26 | (MFG) Rachel Ruan | File Added: MTBF of KLM8G1GETF-B041.pdf | |
| 2024-10-14 16:26 | (MFG) Rachel Ruan | File Added: T99X171.00 FA report on mechanical damage risk (RMA rework process).pptx | |
| 2024-10-14 16:26 | (MFG) Rachel Ruan | File Added: image-12.png | |
| 2024-10-14 16:26 | (MFG) Rachel Ruan | Note Edited: 0016839 | |
| 2024-10-22 14:20 | (ALTech) SH Son | Note Added: 0016866 | |
| 2024-10-22 14:20 | (ALTech) SH Son | Status | assigned => closed |
| 2024-10-22 14:20 | (ALTech) SH Son | Resolution | open => fixed |
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